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flip back中文是什么意思
中文翻译向后翻转&&&&adj. (flipper, flippest) 〔美俚 ...&&&&n. 1.背，背部；背脊；背面，反面；背后，后部，后面， ...&&&&后空翻&&&&向背后挑传&&&&vi. (-pp-) 1.用指头弹；轻轻打。 2.(用鞭子等)抽。 3.叭嗒叭嗒地动；翻动纸张。 4.跳上车。 5.起强烈反应。 6.〔美俚〕失去自制力；入 ...&&&&反手传球法&&&&白兰地菲丽普; 翻转白兰地&&&&egg flip ＝egghead 〔讽俚〕知识份子。 &&&&蛋酒,蛋黄酒; 弗利普）蛋黄酒（一种由葡萄酒加香料、牛奶、蛋黄等调配而成的热饮甜酒&&&&免掀盖音乐播放面版&&&&手指拔球&&&&三氯乙烯商名&&&&翻转角&&&&翻盖接听&&&&手翻书&&&&挑流鼻坎; 挑流消能坎&&&&卡片簿&&&&【计算机】叩焊，(反装)晶片，倒装片(法)。 &&&&磁场线圈; 弹抛线圈; 急转线圈&&&&后手翻; 双稳态多谐振荡器触发电路&&&&啪啪作响&&&&水平翻转&&&&水平翻转&&&&后内点冰跳; 后内点冰一周跳&&&&回转镜
例句与用法The branch flipped back and scratched his face树枝弹回来擦破了他的脸。 Flip back and forth rapidly between two similar bitmaps . what catches your eye ? astronomers once did this routinely to detect comets在两个相似的位图间快速地翻来翻去，你的眼里出现了什么？天文学家曾经遵循这种方法去发现彗星。 " i would do anything to pass this exam . " she leans closer to him , flips back her hair , gazes meaningfully into his eyes . " i mean . . . " she whispers , " . . . i would do . . . anything .“只要能通过这次考试我愿意做任何事。 ”她向他倚靠过去，向后一甩她的秀发，含情脉脉地注视着他的眼睛， “我是说. . . ”她低声耳语道， “我愿意做. . .任何事. . . ” On the plus side , this approach localizes all of your pointcuts and aspect configurations , but it can become tedious if you find yourself frequently editing many advice and pointcuts , and repeatedly flipping back and forth between the java and the xml files从正面来说，这项技术把切入点和方面配置的工作全都局限于本地，但是如果要编辑许多通知和切入点，而且要在java和xml之间重复地翻来覆去，那么这项工作就会变得很繁琐。 &&
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All rights reservedflip chip bonding
flip chip bonder 倒装焊接机
flip chip bonding 倒装焊接
flip coil 探测线圈 ...
基于38个网页-
微电子封装金丝倒装键合的微织构、组织及性能_医学职称论文网
金 倒装键合 EBSD 微织构
[gap=1087]Key words: gold； flip chip bonding； EBSD； microtexture
基于18个网页-
侧装片接合
材料科学专业词汇(F) ...
flip chip bonder 倒装片接合机
flip chip bonding 侧装片接合
float glass process 浮制玻板法 ...
基于12个网页-
技术与倒扣芯片键合
SST-AP China
bonding, WB）技术，而载带自动焊（tape automated bonding, TAB）技术与倒扣芯片键合（flip chip bonding, FCB）技术则旗鼓相当。在可以预见的未来，引线键合技术还能够保持其在一级微电子互连领域中的优势。一般来说，在
基于1个网页-
倒装芯片安装
倒装晶片安装
覆晶组装技术
热超声倒装键合
超声倒装焊
侧装片接合
热超声倒装键合
热超声倒装
倒装焊设备
倒装焊技术
更多收起网络短语
侧装片接合
倒装晶片接合法
&2,447,543篇论文数据，部分数据来源于
The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.
研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性。
Thermosonic flip chip bonding was realized under the pressure constraint pattern of flip chip.
在采用压力约束模式夹持倒装芯片的条件下，实现了热超声倒装健合。
This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.
介绍了芯片倒装焊的重要意义、发展趋势、基本的焊球类型、制作方法及焊球质量的检测技术。
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